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What is the difference between Fusion standard PCB and Fusion Advanced PCB?
What is the difference between Fusion standard PCB and Fusion Advanced PCB?
| Standard board:→Fusion PCB | Custom board:→Fusion Advanced PCB | |
| Why it is cheap/expensive | We will buy lots of metal-clad bade material in the same specification at once to reduce the cost. | We will buy many different kinds of metal-clad bade materials. |
| Put many designs from different customers in one huge panel to manufacture together. | Manufacture different design one by one. | |
| Using the standard and unchangeable processing line. | Change processing step when necessary. | |
| Advantage | Cheap and start from $4.9 | More customized options |
| Production will be fast by standard processing | high-end processing ability | |
| Disadvantage | No more options by standard processing | Expensive by customized the options and processing |
| Need to add a manufacturing number on PCB | Take more time to manufacture. | |
| What kind of people need it | Student, Engineers, Startup, Small enterprise, | Engineers, Purchaser/Buyer of enterprises, Researcher |
| What kind of product need it | Function test For fun Prototype or small batches during early trials | the product for mainstream market the product with high integration design the product with high frequency signal the product cannot be finished with standard PCB |
| Seeed Production Code | The code MUST be printed on the boards | NO code printed on the boards |
| Specification | 1-6 layers | 1-40 layers |
| Quantity | 5-8000 | 5-100k+ |
| Dimension | 10mm*10mm-500m*500m | 2mm*2mm-600mm*800mm |
| Thickness | 0.6mm-2.0mm | 0.2mm-7mm |
| Quality Standard | IPC Class 2 | IPC Class 2/Class 3 |
| Materials | FR-4/Aluminum/Polymide | FR-4/HighTG FR-4/Rogers/taconic/Arlon/Aluminum/Polymide/ |
| Surface finish | Hasl/Hasl lead-free/ENIG | Hasl/Hasl lead-free/ENIG/Hard Gold(Plated Gold)/Nickel/Immersion Sliver/OSP/Carbon/ENIG+Hard Gold |
| Copper weight | 0.5oz. Inner/ Up to 3oz. Outer | Up to 10oz |
| Trace/Spacing | Down to 4/4mil | Down to 2.5/2.5mil Inner, 2/2mil outer |
| Solder Mask Color | Green/Red/Blue/Yellow/Black/White | Green/Red/Blue/Yellow/Black/White |
| Solder Mask Dam | Down to 0.10mm | Down to 0.08mm |
| BGA size | 0.25mm | 0.18mm |
| Min hole size | 0.2mm | 0.1mm mechanical hole/3mil laser hole |
| Castellated Holes | Yes | Yes |
| Impedance Control | Yes | Yes |
| Chamfer on golden finger | Yes | Yes |
| micro vias | No | Yes |
| Blind/Buried Vias | No | Yes |
| Plugged in Vias | No | Yes |
| Via-in-Pad(POFV) | No | Yes |
| Back Drilling | No | Yes |
